| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for wire bonding for improving a strength of a fine metal wire connected by forming an arc between a first bonding point and a second bonding point. SOLUTION: The method for wire bonding comprises the steps of forming a hole 11 for exposing the fine metal wire 5 on a side face of a press-bonding tool 1 for passing the wire 5; providing a heating means 3 facing opposite to the hole 11; and forming an arc (loop) L of the wire 5 between the first bonding point A and the second bonding point B, while heating the wire 5 at a temperature which is lower than the melting point of a material of the wire 5 at a temperature or higher of recrystallizing the material for constituting the wire 5 via the hole 11 by the means 3. |
