| 摘要 |
PROBLEM TO BE SOLVED: To obtain a three-dimensional integrated electronic component that can laminate a plurality of semiconductor devices without requiring an outer lead, an electrode pad on a wiring board, a process for complicated alignment, and a special bonding tool, and to provide a method for laminating the three- dimensional integrated electronic component. SOLUTION: In this integrated electronic component 10, the semiconductor device 12 is die-bonded onto the wiring board 11, wire bonding is carried out for forming a first stage (the lowest stage) for applying a sheet 15 containing spherical filler, a second semiconductor device 12b at the second stage is die- bonded onto the sheet, and wire bonding is performed to the semiconductor device 12 for forming. To form the integrated electronic component 10, above processes are repeated for a required number of times. |
