| 摘要 |
PURPOSE: A heat dissipation type semiconductor package and a manufacturing method thereof are provided to improve thermal dissipation efficiency due to power consumption of semiconductor chip, to increase speed of high frequency semiconductor chip, and to achieve the improvement of characteristics and the stability of quality in semiconductor chip used for RF device. CONSTITUTION: The heat dissipation type semiconductor package includes a die paddle(501), a semiconductor chip(503) mounted on the die paddle(501), and a lead frame. Further, the heat dissipation type semiconductor package has wires(507) electrically connecting bond pads(502) formed on the semiconductor chip(503) and inner leads(505) of the lead frame, a heat-radiating canopy(509) bonded on a top surface of the semiconductor chip(503), and a molding material(504) surrounding all of the die paddle(501), the semiconductor chip(503), the wires(507), the inner leads(505) and a bottom surface of the heat-radiating canopy(509). In particular, the top surface of the heat-radiating canopy(509) is exposed to the exterior, and a portion of the bottom surface of the heat-radiating canopy(509), which is in contact with the semiconductor chip(503), is recessed. |
