RF circuit chip, RF circuit device having the same, and manufacturing method therefor

摘要

To eliminate variations in measurement of the chip characteristics due to an increased bonding pad area, an MMIC chip is configured as follows. A pad main portion having the same width as a main line is provided at an end of the main line that is provided on a GaAs substrate 12. A plurality of pad auxiliary portions in an island-like manner adjacent to the pad main portion on one or both sides thereof. A grounding wiring layer is provided on at least one side of the pad main portion with the pad auxiliary portion interposed in between. The pad main portion and the pad auxiliary portions secure a sufficient bonding area. The electrical characteristics are measured by bringing probes into contact with the pad main portion 16a and the grounding wiring layer(s). The electrical characteristics of the MMIC chip can be evaluated without increase in bonding pad capacitance.