| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor package device in which trouble such as a crack, a disconnection or the like is difficult to occur in a mounting connection section even when external force is applied after mounting connection and mounting bonding strength is increased, and to provide a substrate for mounting the semiconductor package device. SOLUTION: A bump connection type IC package 10 mounted on a mother board through bump electrodes connected to a plurality of electrodes arrayed in a matrix shape has the first electrode lands 1 having areas larger than those of the second electrode lands 2 on the outermost circumferential sides of the second electrode lands 2 on which the bump electrodes are mounted.</p> |
