| 摘要 |
A central processing unit (CPU) heat sink module disposed under a central processing unit (CPU) and a motherboard comprises a conductive member disposed under the motherboard corresponsive to the position of the central processing unit (CPU), and a heat sink disposed on the conductive member, so that the conductive member rapidly transfers the heat source produced by the central processing unit (CPU) to the heat sink thereunder, and effectively disperses the heat source by the heat sink.
|
