发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE DRY FILM OBTAINED BY USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in both sensitivity and stability, and excellent also in balance of various properties such as tent strength, resolution and non-contaminating property of a plating solution, and to provide a photosensitive dry film. <P>SOLUTION: The photosensitive resin comprises contains at least an alkali-soluble resin (A), a photopolymerizable compound (B) and a photopolymerization initiator (C), wherein the photopolymerization initiator (C) contains at least a hexaarylbisimidazole compound (C1) and a polyfunctional thiol compound (C2) as essential components. The photosensitive dry film has at least a photosensitive resin layer formed of the photosensitive resin composition on a support film. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006153984(A) 申请公布日期 2006.06.15
申请号 JP20040340886 申请日期 2004.11.25
申请人 TOKYO OHKA KOGYO CO LTD 发明人 UEMATSU TERUHIRO;KATSUMATA NAOYA
分类号 G03F7/029;C08F2/50;G03F7/004;G03F7/031 主分类号 G03F7/029
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