FILM-CARRIER TAPE, METHOD OF MANUFACTURING FILM-CARRIER TAPE, FILM-CARRIER TAPE ON WHICH IC MODULES ARE MOUNTED, AND METHOD OF MANUFACTURING FILM-CARRIER TAPE ON WHICH IC MODULES ARE MOUNTED

摘要

PROBLEM TO BE SOLVED: To provide a film-carrier tape capable of automatically and accurately positioning itself at a working position including initial working position for a module by a simple process, and a transportation device capable of accurately positioning the tape at the working position with a simple constitution of the device using the film-carrier tape.

SOLUTION: The film-carrier tape is provided with a plurality of IC chips 13 that are respectively mounted on module cutout regions 3 in the length direction of the tape to manufacture IC modules 10, each of which is built in an IC card, by individually cutting out the module cutout regions 3. One piece or more of a positioning hole 4 per one piece or one line of the module cutout region 3 in the width direction of the tape is formed in a predetermined position other than the module cutout regions 3. The transfer device 30 detects the positioning hole 4 with a photosensor to stop the transportation at the predetermined working position.

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