| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for forming a resist pattern by which when a support with copper present on the upper surface thereof is used, the effects of the copper on a resist pattern can be reduced, management and control in production are easy, and the problem of mixing occurs hardly. <P>SOLUTION: The method for producing a resist pattern includes: a stacking step of obtaining a photoresist laminate by stacking (a) a support with copper present on the upper surface thereof, (b) an inorganic layer comprising an inorganic substance supplied from an inorganic substance supply source, and (c) a photoresist layer comprising a chemically amplified negative photoresist composition; an exposure step of selectively irradiating the photoresist laminate with an actinic ray or radiation; and a development step of forming a resist pattern by developing the layer (b) together with the layer (c). <P>COPYRIGHT: (C)2006,JPO&NCIPI |
