| 摘要 |
PROBLEM TO BE SOLVED: To prevent signal delay by directly connecting a laminated semiconductor chip, without using any wire for reducing the conductive path. SOLUTION: The above signal delay can be prevented, and at the same time, packaging area can be reduced by having a substrate for connection, which includes a first projection, on whose top a first electrode for connection is established; and a second projection, which is located outward of installation region of the first projection and, at the same time, formed higher than the first projection and on whose top a second electrode for connection is established, a first semiconductor chip, which is mounted on the first electrode for connection formed on the first projection, and a second semiconductor chip, which is mounted on the second electrode for connection formed on the second projection and makes a laminated form with the first semiconductor chip. COPYRIGHT: (C)2006,JPO&NCIPI
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