发明名称 INSPECTION DEVICE OF SUBSTRATE AND INSPECTION METHOD OF SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide an inspection device of a substrate for precisely detecting the flaw of the pattern on the laminated structure on the substrate, and to provide an inspection method of the substrate. SOLUTION: The inspection device of the substrate is constituted so as to inspect the flaw of the pattern formed on the laminated structure, wherein a second layer, the composition of which is different from that of the first layer on the substrate, so that a part of the second layer is exposed and has an electron discharge means for irradiating the substrate with primary electrons; an electron detecting means for detecting secondary electrons, formed by irradiation with the primary electrons; a data processing means for processing the data of the secondary electrons detected by the electron detecting means; and a voltage control means for controlling the acceleration voltage of primary electrons. The voltage control means is constituted so as to control the acceleration voltage so that the primary electrons reaches the inside the first or second layer other than the vicinity of the interface of the first and second layers, at the part where the second layer has been exposed. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007218695(A) 申请公布日期 2007.08.30
申请号 JP20060038521 申请日期 2006.02.15
申请人 TOKYO ELECTRON LTD 发明人 SAITO MISAKO;HAYASHI TERUYUKI
分类号 G01N23/225;G01B15/04;H01J37/28 主分类号 G01N23/225
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