发明名称 COMPOUND, POSITIVE RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN
摘要 <p>Disclosed are a compound usable for a resist composition, a positive resist composition containing such a compound, and a method for forming a resist pattern. Specifically disclosed is a compound represented by the formula (A-1) below. In the formula (A-1) below, R11-R17 respectively represent an alkyl group or an aromatic hydrocarbon group; g and j respectively represent an integer of not less than 1, k and q respectively represent an integer of not less than 0, and g + j + k + q is not more than 5; b represents an integer of not less than 1, l and m respectively represent an integer of not less than 0, and b + l + m is not more than 4; c represents an integer of not less than 1, n and o respectively represent an integer of not less than 0, and c + n + o is not more than 4; A represents a trivalent aromatic cyclic group, an alkyl group, an alicyclic group, or a trivalent organic group having an aromatic cyclic group or alicyclic group; and Z represents a group represented by the formula (z1) below. In the formula (z1) below, Y represents an alkylene group, a divalent aromatic hydrocarbon group, an alicyclic group, or a divalent organic group having an aromatic hydrocarbon group or alicyclic group; and R' represents an acid-cleavable dissolution inhibiting group. ® KIPO & WIPO 2009</p>
申请公布号 KR20080112412(A) 申请公布日期 2008.12.24
申请号 KR20087028652 申请日期 2008.11.24
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 SHIONO DAIJU;HIRAYAMA TAKU;HADA HIDEO
分类号 C07C69/712;G03F7/004;G03F7/039;H01L21/027 主分类号 C07C69/712
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