| 摘要 |
<P>PROBLEM TO BE SOLVED: To change the array of the electrode pad of semiconductor elements and an outer lead without increasing a package size when loading the plurality of semiconductor elements on a lead frame. <P>SOLUTION: The semiconductor package 1 has the lead frame 2 having an inner lead part 5 provided with an inner lead 21 connected to the outer lead 23 and an inner lead 22 for relay not connected to the outer lead 23. On the lower surface of the lead frame 2, the plurality of semiconductor elements 7 are laminated. The electrode pad 8 of the semiconductor element 7 is connected to the inner lead part 5 through a metal wire 14. One end of the inner lead 22 for relay is connected to the electrode pad 8 through the metal wire 14, and the other end is connected to the outer lead 23 through a metal wire 24 for relay arranged so as to go over the inner lead 21. <P>COPYRIGHT: (C)2009,JPO&INPIT |
