| 摘要 |
PURPOSE:To provide a semiconductor capacitive acceleration sensor with a highly reliable through-hole part which is manufactured with an excellent yield. CONSTITUTION:In the acceleration sensor, a mass part, (movable electrode) 2 and a silicon plate 1 of a single crystal with a cantilever 3 are held between glass plates 4 and 5 having fixed electrodes 6 and 7. That is, the acceleration sensor is in a structure of three layers. A through-hole part 9 is provided at a connecting path from the fixed electrode 6 to a wire bonding pad 11. A reinforced part of a conductive film is set at a part of an electrode lead part 8 including the through-hole part 9. Therefore, the conductive film is sufficiently secured at an inner wall of the through-hole part 9 in the connecting path to the wire bonding pad 11 without thickening the fixed electrode 6 to a required thickness or larger. A disconnection or inferior connection at the through hole part 9 is restricted. |
