| 摘要 |
The present invention relates to a polyamide resin composition with heat resistance and solubility in a common solvent; and to a manufacturing method thereof, and more specifically, to polyamide and a manufacturing method thereof, wherein the polyamide has heat resistance and enhanced solubility in a common solvent (water, ethanol, DMSO, etc.) as the crystallinity of the polyamide is controlled by properly mixing tris(amine) and diamine and polymerizing the mixture composed of tris(amine) and diamine with diacid. According to the present invention, provided is polyamide which has heat resistance and solubility in a common solvent such as water, ethanol, DMSO, etc. Specifically, the polyamide manufactured according to the present invention has a melting point of 165-175°C and relatively maintains the specific heat resistance of existing polyamide. Moreover, the polyamide shows a solubility of 0.5-10 wt% even in a polar solvent such as water, ethanol, and DMSO as well as a nonpolar solvent at room temperature. Accordingly, the polyamide can be used as a coating agent by the solubility, and shows solubility to such an extent as to be used for a coating process using a polar solvent including water. Therefore, an existing coating process using an organic solvent is substituted with a coating process using a common solvent. Moreover, a solid coating film can be formed so the polyamide can be used for a functional coating agent in the field of industry requiring a solid coating film with high heat resistance. |
