PLASMA PROCESSING DEVICE

摘要

A plasma processing device processes a substrate by generating plasma using a surface wave formed on a surface of a shower plate by a supplied microwave, which includes a plasma generating antenna equipped with the shower plate for supplying first and second gases into a processing vessel, and a drooping member installed to protrude downward from a lower end surface of the shower plate. An outer surface of the drooping member spreads outward as it goes from a top end to a bottom end thereof. The shower plate includes first and second gas supply holes through which the first and second gases are supplied into the processing vessel, respectively. The first gas supply holes are disposed inward of the outer surface of the drooping member. The second gas supply holes are disposed outward of the outer surface of the drooping member.

主权项

1. A plasma processing device that processes a substrate by generating plasma using a surface wave formed on a surface of a shower plate by a supplied microwave, the plasma processing device including a plasma generating antenna which is equipped with the shower plate configured to supply a first gas and a second gas into a processing vessel, the plasma processing device comprising:
a drooping member made of a conductor and installed to protrude downward from a lower end surface of the shower plate, wherein an outer surface of the drooping member spreads outward from a top end to a bottom end of the outer surface of the drooping member, wherein the shower plate includes a plurality of first gas supply holes through which the first gas is supplied into the processing vessel and a plurality of second gas supply holes through which the second gas is supplied into the processing vessel, wherein the first gas supply holes are disposed inward of the outer surface of the drooping member, and wherein the second gas supply holes are disposed outward of the outer surface of the drooping member.