| 摘要 |
The present invention relates to a finger clip bonding semiconductor package and, especially, to a finger clip bonding semiconductor package, forming all of multiple bonding pads on the upper surface of a semiconductor chip, and connecting the bonding pads and a lead frame by using a clip having multiple fingers on the upper surface of the semiconductor chip. The present invention improves a soldering characteristic and allows a high current to flow quickly through a source and a drain which are signal input and output terminals. |
