发明名称 Three-dimensional backplane
摘要 An objective of the present invention is to provide a three-dimensional backplane to solve the problem that the number of layers of a printed circuit board for producing a backplane increases linearly along with the number of connectors. The three-dimensional backplane includes: a first group of connectors, a second group of connectors, a first group of printed circuit boards, and a second group of printed circuit boards. Any printed circuit board in the first group of printed circuit boards is connected to any printed circuit board in the second group of printed circuit boards. Any connector in the second group of connectors is connected to any connector in the first group of connectors. With the foregoing solution, the number of wires on each printed circuit board is reduced, so that the number of layers of a printed circuit board for producing a backplane is reduced.
申请公布号 US9445509(B2) 申请公布日期 2016.09.13
申请号 US201314056407 申请日期 2013.10.17
申请人 Huawei Technologies Co., Ltd. 发明人 Chen Songhai;Tang Shiping
分类号 H05K1/11;H05K3/36;H04L12/931 主分类号 H05K1/11
代理机构 Leydig, Voit & Mayer, Ltd. 代理人 Leydig, Voit & Mayer, Ltd.
主权项 1. A three-dimensional backplane, comprising: a first group of electrical connectors, a second group of electrical connectors, a first group of printed circuit boards, and a second group of printed circuit boards, wherein: the first group of electrical connectors comprises at least two electrical connectors; the second group of electrical connectors comprises at least two electrical connectors; the first group of printed circuit boards comprises at least two printed circuit boards, or the second group of printed circuit boards comprises at least two printed circuit boards; the first group of connectors is disposed on the first group of printed circuit boards; the second group of connectors is disposed on the second group of printed circuit boards; each printed circuit board in the first group of printed circuit boards is connected to all printed circuit boards in the second group of printed circuit boards; each printed circuit board in the second group of printed circuit boards is connected to all printed circuit boards in the first group of printed circuit boards; each electrical connector in the first group of electrical connectors is connected to all electrical connectors in the second group of electrical connectors through all connections between a printed circuit board, where the electrical connector is disposed, in the first group of printed circuit boards and all printed circuit boards in the second group of printed circuit boards; each electrical connector in the second group of electrical connectors is connected to all electrical connectors in the first group of electrical connectors through all connections between a printed circuit board, where the electrical connector is disposed, in the second group of printed circuit boards and all printed circuit boards in the first group of printed circuit boards; wherein: when the first group of printed circuit boards comprise at least two printed circuit boards, all printed circuit boards in the first group of printed circuit boards are parallel to each other; and when the second group of printed circuit boards comprises at least two printed circuit boards, all printed circuit boards in the second group of printed circuit boards are parallel to each other; wherein the first group of printed circuit boards are perpendicular to the second group of printed circuit boards; wherein the three-dimensional backplane further comprises a fixing board; and wherein the first group of printed circuit boards and the second group of printed circuit boards are fixed on the fixing board.
地址 Shenzhen CN