| 摘要 |
PURPOSE:To enhance heat radiation by providing a heat-conductive material which is connected to the back side facing to the pellet-fixed surface of a tab, exposed from one surface of a resin sealed body and having the heat conductivity higher than that of a sealed body. CONSTITUTION:A heat conducting material 6 is arranged on the back side opposing to the fixed surface of the pellet of a tab C. The heat conducting material 6 is coupled to the back side of the tab 4C, and it is exposed from the mounting surface 2A of a resin-sealed body 2. The heat conducting material 6 is formed by the Pb-Sn alloy solder maternal having the thermal conductivity of 826X10<-4>cal/cm.sec. deg.C or thereabout. The solder material has high adhesive strength with the tab 4C, and low adhesive strength with the semi-sealed body 2. Accordingly, the thermal resistance between the back side of the tab 4C and the mounting surface 2A, which is one surface of the resin-sealed body 2, can be decreased. As the heat generated by the function of the circuit system, which is mounted on a semiconductor pellet 3, can be discharged to the outside of the semi-sealed body 2 through the heat conducting material 6, and heat radiating efficiency can be enhanced. |
