| 摘要 |
PURPOSE:To mount easily an electronic component mount device, which has pads formed with bumps and the like on the surface on the side to be mounted, and a surface mount component, such as a semiconductor chip, on a printed- wiring board and at the same time, to reduce the cost for the development of a device to mount the surface mount component. CONSTITUTION:First laser beams L1 are respectively emitted on diagonal positions T1 of bumps 5 of a ball grid array 1. Then, the array 1 is moved front an emission surface A-A1 and second laser beams are respectively emitted on the surface A-A1 via filters frog the opposite directions to the emitted directions of the beams L1. Then, the filters are moved and a printed-wiring board is arranged on the surface A-A1 in such a way that the second laser beams are emitted on diagonal positions of pads for mounting of the printed- wiring board being made to correspond to the emitted parts of the bumps 5 emitted with the first laser beams L1. After the array 1 is again returned to the former surface A-A1, each bump 5 of the array 1 is bonded on each pad for mounting of the board. |
