| 摘要 |
PURPOSE:To enable easy formation of an opening for picking up light in an image device wherein an image array is connected by a flip chip to an opaque substrate. CONSTITUTION:An about 1 to 2mm-wide opening 20 is formed in a rigid printed board 2, a photosensitive resin film 16 is laminated on the board 2 and the resin film 16 is provided with a 0.1mm-wide opening 24. The opening 20 is charged with transparent resin 22 to prevent the resin film 16 from drooping inside the opening 20. |
