High frequency welded encapsulation and spot bonding

摘要

Forms a high frequency welded bond between a sheet encapsulating material - a high frequency (HF) weldable polar plastic, and a non HF-weldable plastic body. The body, having holes (5), together with sheet(s) of the polar material (3), are sandwiched between the upper (1) and lower (2) electrodes of the HF welding machine. On heating, the holes fill with molten plastic, which, when cooled, forms the bond. If a sandwich of two fusible outer sheets is used, through-hole bonding results. If a single upper fusible sheet is used above upwardly-tapering holes (7) in the non-meltable body, then the cooled and resolidified plastic in the holes forms a keyed-in physical form-bond. Methods of marking the capsule surface and sizing the holes in the body are also claimed. In addition the encapsulated product itself, made by the process described, is claimed.