| 摘要 |
An apparatus for use in electroplating cylindrically shaped objects which comprises a reservoir for an electroplating solution, said reservoir having a bottom, side walls and a substantially open upper end opposite the bottom. A support member is provided which is adapted to hold a cylindrically shaped object to be electroplated within the reservoir in a substantially vertical position below the level of the electroplating solution in the reservoir. The support member has means by which it is removably supported by the reservoir at the upper end thereof and is electrically insulated therefrom. Means are provided for effecting rotation of the support member and the object to be electroplated within the reservoir around the vertical axis of the reservoir, the rotation effecting means being electrically insulated from the support member. The support member has oppositely disposed, adjustable engaging members which are adapted to engage the cylindrically shaped object to be electroplated and hold it in a substantially vertical position within the reservoir. The engaging members are in electrical contact with the object to be plated and are electrically connected to that portion of the support member which is supported by the reservoir. There are means for providing electrical insulation between the electrical plating solution in the reservoir and the outer surfaces of the support member in contact therewith and means for preventing plating of that portion of the object to be plated at and contiguous to the point of electrical contact with the engaging members. Anode means are disposed within the reservoir, at least partially below the level of the electroplating solution and positioned between the reservoir side walls and the cylindrically shaped object to be electroplated which is held in the support member.
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