| 摘要 |
The device is a tweezers or tool particularly constructed and adapted for picking up and handling thin fragile objects such as silicon wafers or the like. The noses or jaws of the tweezer parts or legs are particularly configurated for the purpose intended. The end parts or jaws of the tweezer legs are configurated to limit the inward movement of the wafer or other object between the jaws and also to limit the opening movement of the jaws. The invention embodies several different preferred configurations for accomplishing these purposes.
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