PROCESS FOR DELAMINATING ORGANIC RESIN FROM BOARD AND PROCESS FOR MANUFACTURING ORGANIC RESIN MULTI-LAYER WIRING BOARD

摘要

A process for delaminating an organic resin insulation layer and a board therefo r without adversely affecting the organic resin multi-layer wiring layer. A polyim ide insulation layer is formed on a quartz glass board. Another polyimide insulation layer and a wiring layer, which together with the polyimide insulation layer for m a first block, are laminated on the polyimide insulation layer. The back of the qu artz glass board is irradiated with an excimer laser to delaminate the first block an d the quartz glass board. Ultraviolet rays from the excimer laser react with the polyi mide insulation layer in a photochemical reaction which removes the polyimide insulat ion layer located at the interface with the quartz glass board and delaminates the quartz glass board from the first block.