| 摘要 |
<p>PURPOSE:To accelerate heat radiation from a chip and to fasten a TAB lead and to avoid the deformation of the TAB lead by providing the device with a radiation section which covers the chip, a presser board which covers an insulating film located at an outer lead section of the TAB lead, and a heat sink having a fixed terminal. CONSTITUTION:A heat sink 1 is made of a metal such as copper (Cu) and is constituted of a radiating section 4 which covers a chip 2, a presser board 6 which covers a part near an outer lead 5 of a TAB lead 4, a fixed terminal 8 which fastens the presser board 6 on a circuit board, and a supporting board 9 which connects the radiating section 3 and the presser board 6. The chip 2 is bonded to the heat sink 1 with material of a good heat conductivity and heat generated by the chip 2 passes through the supporting board 9 and then passes through the presser board 6 and the fixed terminal 8 and is finally radiated through a pad 10 for fixing formed on the circuit board 7. By this method, the deformation of the TAB lead can be prevented and the radiation is increased during the chip mounting work.</p> |
