Process for Delaminating Organic Resin from Board and Process for Manufacturing Organic Resin Multi-Layer Wiring Board

摘要

A process for delaminating an organic resin insulation layer and a board therefor without adversely affecting the organic resin multi-layer wiring layer. A polyimide insulation layer 121 is formed on a quartz glass board 111. On the polyimide insulation layer 121 are laminated another polyimide insulation layer and a wiring layer which form a first block 100 together with the polyimide insulation layer 121. Irradiation from an excimer laser on the back of the quartz glass board 111 is performed to delaminate the first block 100 and the quartz glass board 111. UV rays from the excimer laser 1 and the polyimide insulation layer 121 undergo a photochemical reaction to remove the polyimide insulation layer 121 located at the interface with the quartz glass board 111 and to delaminate the quartz glass board 111 from the first block 100.