发明名称 DEVICE AND METHOD FOR BONDING
摘要 PURPOSE:To reduce the impact load given to the surface of bonding by lowering the gain characteristics of a driving circuit before a bonding tool reaches the bonding surface. CONSTITUTION:A working pattern signal A is outputted at the time T1 by a control circuit, a capillary tool 2 is lowered at a high speed V1, and when the capillary 2 reaches a search level SL, it is lowered at a low speed V2. When the tip of the capilary 2 reaches the point of the preset value which is stored in a memory in advance, the gain of the control circuit is changed to low gain characteristics. When the ball 3a is brought into contact with the bonding surface S at the time T3, the lowering speed of the capillary tool 2 suddenly becomes slow. When the ball 3a is brought into contact with the bonding surface at the time T4, the output of the working pattern signal A is stopped by the control circuit. The deviation between the working pattern signal A and a feedback signal B becomes large, but as gain is low, a large impact load is not given to the bonding surface.
申请公布号 JPH07161752(A) 申请公布日期 1995.06.23
申请号 JP19930283449 申请日期 1993.11.12
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 ARIKADO KAZUO
分类号 H01L21/60 主分类号 H01L21/60
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