发明名称 CONNECTING PART INSPECTING METHOD IN MOUNTING LSI CHIP, ETC.
摘要 PURPOSE:To perform the direct, accurate detection of the connecting state of electrodes and a conductive particle by casting infrared rays on the conducting particle as the modulation light from the outside, oscillating the particle, and detecting the difference in oscillating mode. CONSTITUTION:Infrared rays 7 transmitted through an Si chip 4 are condensed on a chip electrode 5 by a condenser lens, and a conductive particle 3 is irradiated. Then, the particle 3 receives periodic energy, and thermal oscillation occurs. When the frequency of the infrared rays is matched with the natural oscillation of the particle 3, the large steady-state oscillation occurs in the particle 3. At this time, the oscillation mode and the resonant frequency are different depending on the sufficient/insufficient connection between the substrate-side electrode 2 and the electrode 5, and the particle 3. Then, the modulating frequency of the light is adequately changed, and the quality of the connection of the particle 3 with the electrodes 2 and 5 can be detected. In this way, the defective conduction of the connecting part, when the electric connection between the electrodes is carried out through the conductive particle, can be directly detected in high accuracy.
申请公布号 JPH07159380(A) 申请公布日期 1995.06.23
申请号 JP19930340480 申请日期 1993.12.08
申请人 RICOH CO LTD 发明人 SAKATSU TSUTOMU
分类号 G01N29/00 主分类号 G01N29/00
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