| 摘要 |
PURPOSE:To increase the amount of solder and to improve the soldering strength, by constituting the output of pump so that it is changed, and by making arrangement so that the height of jet flow is changed within the limit of soldering condition. CONSTITUTION:When printed substrate 18 is brought to a prescribed location, the output of pump 13 is increased and plane of jet flow 15 of solder 14 is brought up and moves so that it contacts with the lower surface of printed substrate 18. When the whole area of lower surface of printed substrate 18 contacts with plane of jet flow 15, the output of pump 13 is reduced by the signal which has detected the location of hanger 16, and plane of jet flow 15 is lowered and separated from the lower surface of printed substrate 18. Under this condition, printed substrate 18 is sent along the direction of arrow A by hanger 16 and soldering is completed. When soldering is made in this manner, solder 20 is adhered spheroidally to lead terminal 19 of electronic parts 17 mounted on printed substrate 18 and the rand section of substrate 18, and the reliability of soldering strength is considerably high. |
