| 摘要 |
<p>PURPOSE:To secure the consistance of narrowing electrode pitch with lowering impedance of electrode line by a method wherein a multiple electric connection mode is used together in the same driver LSI chip so as to effectively take the advantages of respective connecting modes. CONSTITUTION:In order to fix a driver LSI chip 11 to a PET film 12, the output pins 11a of the driver LSI chip 11 and an ITO film 13 are electrically connected. On the other hand, the driver LSI and a Cu foil 15 are electrically connected by wire bonding process. That is, the COP mode used as the connection mode between the driver LSI 11 and the ITO film 13 suitable for narrowing pitch is naturally suitable for the miniaturization due to the thin ITO film 13. On the other hand, the wire bonding mode used as the connection mode between the driver LSI 11 and the Cu foil 15 can lower the impedance for the connection due to the Cu foil 15 as a wiring whose impedance can be easily lowered.</p> |
