发明名称 |
TAB type semiconductor device and method of manufacturing the same |
摘要 |
This invention provides a TAB type semiconductor device in which a plurality of lead pattern regions are formed on a film-like tape formed of an insulating resin, and LSI chips are inner lead-bonded onto the corresponding lead pattern regions. A linear reference potential supply wiring pattern is formed on one edge portion in the widthwise direction of a formation surface of the lead pattern regions on the tape to extend in the tape extending direction. The wiring pattern is electrically connected to a reference potential supply lead (14A) of each lead pattern region.
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申请公布号 |
US5237201(A) |
申请公布日期 |
1993.08.17 |
申请号 |
US19910795257 |
申请日期 |
1991.11.19 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
TANAKI, TORU;SUZUKI, YASOJI |
分类号 |
H01L23/495;H05K1/02 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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