发明名称 Shielded enclosure for housing electronic components and manufacturing method thereof
摘要 An EMI protected enclosure and method of manufacture thereof. The enclosure is plastic and has an electromagnetic interference shield member disposed therein to protect the electronic parts or electronic equipment from electromagnetic interference. The electromagnetic interference shield member is exposed at the edges of the enclosure and can be formed into an electrical connector or otherwise connected to provide a ground for the enclosure. In the manufacturing method, the securing and shaping of the electromagnetic interference shield member by the closure of the molding dies eliminates the need for any pre-forming of the electromagnetic interference shield member.
申请公布号 US5473111(A) 申请公布日期 1995.12.05
申请号 US19930120468 申请日期 1993.09.14
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 HATTORI, YOSHIYUKI;HATAYOSHI, MUTUO
分类号 B29C45/14;B29C70/88;H05K9/00;(IPC1-7):H05K9/00 主分类号 B29C45/14
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