CURABLE RESIN COMPOSITION CONTAINING A MICROPARTICULATE SILICONE RUBBER

摘要

The curable resin composition of the present invention consists of a curable resin and the spherical microparticles of cured silicone rubber obtained by the curing of an addition reacting silicone rubber composition, wherein the silicone rubber composition also contains an epoxy compound having an aliphatically unsaturated group. Furthermore, because the microparticles are prepared from an aqueous emulsion or aqueous dispersion of the silicone rubber composition, they have an extremely small particle size. The curable resin compositions of this invention can be used as an insulating material for electrical and electronic components, in the form of precision moldings, sealants, casting agents, coatings, and powder coatings.