发明名称 |
SOLDERABLE CONNECTOR FOR HIGH DENSITY ELECTRONIC ASSEMBLIES |
摘要 |
<p>An improved connector for an electronic module or the like includes a housing having a socket opening that is sized and configured to accept an electronic module, and a plurality of terminals mounted to the housing. Each of the terminals has a foot portion having a layer of non-solderable material coated on one side of the foot portion to prevent solder from adhering to that side. A capillary nest is formed by a channel surface on the underside of the foot portion when the terminal is mounted on a conductor pad such that solder flows through the capillary nest under the influence of capillary forces from the side of the terminal having a non-solderable coating thereon to the other side for forming a solder joint on that other side. A ring of non-solderable material is coated around a middle portion of the terminal to prevent solder from flowing to the electrical contact surfaces located above the ring. As a result, the connector terminals can be soldered to a printed circuit board or the like in a simple and inexpensive manner and without the formation of known solder defects.</p> |
申请公布号 |
EP0729650(A4) |
申请公布日期 |
1997.01.15 |
申请号 |
EP19950901232 |
申请日期 |
1994.11.14 |
申请人 |
BERG ELECTRONICS MANUFACTURING B.V.;CONNECTOR SYSTEMS TECHNOLOGY N.V. |
发明人 |
BELOPOLSKY, YAKOV |
分类号 |
H01R33/76;H01L23/32;H01R4/02;H01R12/04;H01R12/32;H05K3/34;(IPC1-7):H01R4/02 |
主分类号 |
H01R33/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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