| 摘要 |
PCT No. PCT/JP96/01264 Sec. 371 Date Feb. 9, 1998 Sec. 102(e) Date Feb. 9, 1998 PCT Filed May 14, 1996 PCT Pub. No. WO96/36496 PCT Pub. Date Nov. 21, 1996A condenser, a coil and a thin-thickness integrated circuit are placed between an upper cover sheet and a lower cover sheet, and adhesive is filled into the space between them, whereby a card is fabricated. Because the condenser, the coil and the thin-thickness integrated circuit are extremely thin, the resulting semiconductor device is highly resistant to bending and highly reliable at a low cost.
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