Method of drying semiconductor wafers using hot deionized water and infrared drying

摘要

Methods for drying semiconductor wafers following a chemical cleaning process utilize both a hot deionized water bath and medium-wavelength infrared light drying techniques. A preferred method comprises the steps of (a) maintaining a body of hot deionized water in a bath; (b) submerging multiple wafers to be dried in the body of hot deionized water in said bath; (c) slowly pushing said multiple wafers up through the surface of the body of hot deionized water in said bath; (d) providing an infrared bath containing an infrared lamp; and (e) transferring said multiple wafers to said infrared bath for drying.