发明名称 POWER CONVERSION APPARATUS
摘要 Technology leading to a size reduction in a power conversion apparatus comprising a cooling function and technology relating to enhancing productivity and enhancing reliability necessary for commercial production are provided. Series circuits comprising an upper arm and lower arm of an inverter circuit are built in a single semiconductor module 500. The semiconductor module has cooling metal on two sides. An upper arm semiconductor chip and lower arm semiconductor chip are wedged between the cooling metals. The semiconductor module is inserted inside a channel case main unit 214. A DC positive electrode terminal 532, a DC negative electrode terminal 572, and an alternating current terminal 582 of a semiconductor chip are disposed in the semiconductor module. The DC terminals 532 and 572 are electrically connected with a terminal of a capacitor module. The alternating current terminal 582 is electrically connected with a motor generator via an AC connector.
申请公布号 US2017105321(A1) 申请公布日期 2017.04.13
申请号 US201615388059 申请日期 2016.12.22
申请人 HITACHI, LTD. 发明人 TOKUYAMA Takeshi;NAKATSU Kinya;SAITO Ryuichi
分类号 H05K7/20;H01L23/50;H02M7/5387;H01L23/473 主分类号 H05K7/20
代理机构 代理人
主权项 1. A power conversion apparatus comprising: a plurality of semiconductor modules that include a series circuit of upper and lower arms of an inverter circuit and have a positive electrode terminal, a negative electrode terminal, and an alternating current terminal; a coolant passage formed between each two neighboring semiconductor modules of the plurality of semiconductor modules; and a capacitor module that is disposed so that a longitudinal side of the capacitor module is parallel to an arrangement direction of the plurality of semiconductor modules, the capacitor module having a plurality of capacitor terminals that are disposed along the longitudinal side of the capacitor module and are connected to the positive electrode terminal and the negative electrode terminal of the plurality of semiconductor modules, wherein the plurality of semiconductor modules are arranged so that the positive electrode terminal and the negative electrode terminal are closer to the capacitor module than the alternating current terminal.
地址 Tokyo JP