发明名称 |
HEAT CONDUCTIVE PLASTIC RADIATOR AND COMMUNICAITON DEVICE |
摘要 |
A heat conductive plastic radiator and a communication device are provided. The communication device includes the heat conductive plastic radiator, a communication chip and an antenna. The heat of the communication chip is dissipated by the heat conductive plastic radiator. Along any direction, the heat conductive plastic radiator has a plurality of cross-sections perpendicular to the direction, and the plurality of cross-sections have different shapes. Therefore, one of the advantages of the heat conductive plastic radiator is that it less severely interferes with the antenna while efficiently dissipating heat. |
申请公布号 |
US2017105315(A1) |
申请公布日期 |
2017.04.13 |
申请号 |
US201615284544 |
申请日期 |
2016.10.04 |
申请人 |
Sercomm Corporation |
发明人 |
Huang Yuan-Heng |
分类号 |
H05K7/20;H05K1/02;F28F21/06 |
主分类号 |
H05K7/20 |
代理机构 |
|
代理人 |
|
主权项 |
1. A heat conductive plastic radiator, adapted to dissipate heat of a communication chip, wherein along any direction, the heat conductive plastic radiator has a plurality of cross-sections perpendicular to the direction, the plurality of cross-sections have different shapes, and the heat conductive plastic radiator is a single piece. |
地址 |
Taipei TW |