发明名称 HEAT CONDUCTIVE PLASTIC RADIATOR AND COMMUNICAITON DEVICE
摘要 A heat conductive plastic radiator and a communication device are provided. The communication device includes the heat conductive plastic radiator, a communication chip and an antenna. The heat of the communication chip is dissipated by the heat conductive plastic radiator. Along any direction, the heat conductive plastic radiator has a plurality of cross-sections perpendicular to the direction, and the plurality of cross-sections have different shapes. Therefore, one of the advantages of the heat conductive plastic radiator is that it less severely interferes with the antenna while efficiently dissipating heat.
申请公布号 US2017105315(A1) 申请公布日期 2017.04.13
申请号 US201615284544 申请日期 2016.10.04
申请人 Sercomm Corporation 发明人 Huang Yuan-Heng
分类号 H05K7/20;H05K1/02;F28F21/06 主分类号 H05K7/20
代理机构 代理人
主权项 1. A heat conductive plastic radiator, adapted to dissipate heat of a communication chip, wherein along any direction, the heat conductive plastic radiator has a plurality of cross-sections perpendicular to the direction, the plurality of cross-sections have different shapes, and the heat conductive plastic radiator is a single piece.
地址 Taipei TW