OPENING PATTERN FORMING METHOD AND MANUFACTURING METHOD OF MATRIX SUBSTRATE USING IT

摘要

PROBLEM TO BE SOLVED: To solve the problem where the application frequencies required in photolithography is generally 5-6 times across the entire process, resulting in a longer manufacturing process, since a contact hole is formed at an inter-layer insulating film between two wiring layers by a photolithography technology to connect the lower-layer wiring to the upper-layer wiring in the process for manufacturing a TFT array. SOLUTION: A lower-layer wiring 2 is formed on a substrate 1 on which an inter-layer insulating film 3 and an upper-layer metal film 4 are sequentially deposited. An opening 5 is formed at the upper-layer metal film 4 by laser beam. With the upper-layer metal film 4 formed at the opening 5 as a mask, the inter-layer insulating film 3 left at the opening 5 is removed. Thus, a photolithography process for forming a contact hole is omitted for shorter manufacturing process.