METHOD FOR POLISHING SEMICONDUCTOR WAFER

摘要

PURPOSE: A method for cleaning slurry residues generated on a polishing pad after the completion of a CMP process is provided to easily clean and to minimize contamination by using two slurry materials. CONSTITUTION: In the method for polishing a semiconductor wafer temporarily mounted on a carrier, a surface of the wafer on a first pad on a first polish table is roughly polished by using a first slurry solution. Then, the wafer is removed from the first polish table. The first pad is rinsed with a cleaning fluid. The wafer and carrier are rinsed with a second fluid. The wafer surface is then secondly polished with a second slurry solution. Then, the wafer, the carrier and the pad are simultaneously rinsed that the second polishing is performed on with a third fluid while the wafer surface remains in contact with the pad by applying low pressure force between the wafer surface and the pad to complete the second polish step.