| 摘要 |
PROBLEM TO BE SOLVED: To efficiently fasten a semiconductor element on an electrode, in particular when the semiconductor element is alight-emitting element, to fasten the semiconductor element on an electrode, without causing lowering of the light-emitting efficiency. SOLUTION: At least a part of the surface to be fastened of the semiconductor element is coated with Au, and the semiconductor element is placed on an electrode containing at least one material selected from among a group of Au, Ag and Al. By subjecting it to heating and/or ultrasonic vibration, the semiconductor element is fastened to the electrode. |
