POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING THE SAME AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a high sensitivity positive type photosensitive resin composition having superior mechanical characteristics, adhesiveness and water absorbing property as characteristics of a film after curing and capable of giving a pattern having high resolution and a high rate of a residual film. SOLUTION: The positive type photosensitive resin composition comprises 100 pts.wt. alkali-soluble resin, 1-100 pts.wt. photosensitive diazoquinone compound (B) and a filler (C) and the content F of the filler (C) represented by the equation F=(filler (C))/[(alkali-soluble resin)+(filler (C))] is 2-70 wt.%.