发明名称 |
Värmeavledande hölje med diagonalformade flänsade profiler |
摘要 |
In a heat dissipating internally fan-less housing (20) for electronic circuits and components (28), the housing has an assembly of two container (10) parts comprising heat-sink fins (12). Each part has a substantially diagonal (14) shaped profile. In the housing, a circuit-board (29) is mounted along the diagonal (14) profile thus providing that the long-side ends of the circuit-board (29) on each side of the board are covered by a greater mass of heat-sink fins (12) compared to a horizontally mounted circuit board for a better cooling of components. |
申请公布号 |
SE524893(C2) |
申请公布日期 |
2004.10.19 |
申请号 |
SE20020003370 |
申请日期 |
2002.11.14 |
申请人 |
PACKETFRONT SWEDEN AB |
发明人 |
ELO ANDERS;ERIKSSON JOERGEN;SONESSON NICLAS |
分类号 |
H05K7/14;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H05K7/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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