发明名称 Method of manufacturing a semiconductor device having a protection circuit
摘要 The semiconductor device includes a plurality of transistors, wherein one of the transistors that has the thinnest gate dielectric layer is selected to serve as a power source protection element, among a plurality of transistors, each having a gate dielectric layer of an independently set film thickness, disposed on a same substrate to be operated by a voltage from a same power source. Also, a threshold voltage of the transistor selected as the power source protection element is set higher than other transistor that also has the thinnest gate dielectric layer.
申请公布号 US2005168895(A1) 申请公布日期 2005.08.04
申请号 US20050097119 申请日期 2005.04.04
申请人 NEC ELECTRONICS CORPORATION 发明人 AKIYAMA NAOTO
分类号 H01L27/04;H01L21/822;H01L21/8234;H01L21/8244;H01L27/06;H01L27/088;H01L27/10;H01L27/105;H01L27/11;(IPC1-7):H02H9/00 主分类号 H01L27/04
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