| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To enable application to the inner layer of a multilayer substrate and reduction in the variation of resistance values as well as improvement in accuracy of a shape at the time of resistance body formation by improving the shape of a resistance body in a wiring board with a resistive element. <P>SOLUTION: On the substrate of a base, the wiring board with a resistive element is connected with a resistance body 7 and a pair of element electrodes via a second electrode 4 provided for mitigating contact resistance. It is provided with an element electrode 3 provided on the substrate, a second electrode provided on this element electrode, an insulating layer 5 embedded where the upper surface of the second electrode is exposed on the whole surface from the substrate between the element electrode and the second electrode, and a resistance body provided between the second electrodes. The insulating layer and the upper surface of the second electrode exposed on the insulating layer upper surface are flat. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
