| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin film device capable of securing operation performance by sufficiently insulating a conductive film pattern from the circumference. SOLUTION: A recess 11S is provided in an insulating substrate 11 outside a region where the insulating substrate 11 and the conductive film pattern 12 make contact with each other, and adjoining to that region. In a manufacturing process of the thin film device 10, a resin insulating film 14 is likely to be filled so as to coat the conductive film pattern 12 covered with a covering insulating film 13 so that the conductive film pattern 12 is sufficiently insulated from the circumference. COPYRIGHT: (C)2007,JPO&INPIT
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