发明名称 CUPRIC ELECTROLYTE SOLUTION, AND METHOD FOR FORMING ELECTRODEPOSITED COPPER FILM USING THE SOLUTION
摘要 PROBLEM TO BE SOLVED: To provide a sulfuric-acid-based cupric electrolyte solution in which a glossy electrodeposited copper film can be formed which has not been obtained in a conventionally available cupric electrolyte solution. SOLUTION: The sulfuric-acid-based cupric electrolyte solution includes 3-mercapto-1-propane sulfonate, and/or bis(3-sulfopropyl)disulfide, a polymer of a quarternary ammonium salt having a cyclic structure, and chlorine. The copper film formed by electrodeposition in the cupric electrolyte solution has a profile with such a low surface roughness (Rzjis) as less than 1.0μm and a glossiness [Gs (60°)] of 400 or higher on the surface in a deposition side. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007217788(A) 申请公布日期 2007.08.30
申请号 JP20060100230 申请日期 2006.03.31
申请人 MITSUI MINING & SMELTING CO LTD 发明人 MATSUDA MITSUYOSHI;SAKAI HISAO;TOMONAGA SAKIKO;DOBASHI MAKOTO
分类号 C25D1/04;C25D3/38 主分类号 C25D1/04
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