| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processor capable of preventing particles from sticking to the surface of a substrate. SOLUTION: The substrate processor 10 has in a chamber 11 a susceptor 12 for mounting thereon a wafer W, and a lower high-frequency power supply 20 is connected with the susceptor 12. Also, an electrostatic chuck 42 having therein an electrode plate 23 is disposed in the upper portion of the susceptor 12, and further, a DC power supply 24 is connected with the electrode plate 23. Moreover, the lower high-frequency power supply 20 applies a predetermined high-frequency power to the susceptor 12, and thereafter, the DC power supply 24 so applies a negative voltage to the electrode plate 23 that the electrostatic chuck 42 attracts the wafer W by a Coulomb force, etc. COPYRIGHT: (C)2007,JPO&INPIT |
