| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer circuit board advantageous for densification of through-holes which can fully secure electrical connections to an inner layer circuit within a core substrate, even if the core substrate is processed in multilayer. SOLUTION: In the multilayer circuit board with a multilayer core substrate having a conductor layer in inner layer, the through-holes each having a land exposed on the core substrate front surface are formed in the multilayer core substrate, and a filling material is filled up in each through-hole, and the conductor layer, which is located directly upward from the land, is formed by a non-electrolytic plating film and electrolytic plating film. A via hole is connected to the electrolytic plating film, and the non-electrolytic plating film is contacted with the filling material, and rough processed layers are formed in a side of the through-hole land, and a side and top of the conductor layer formed directly upward from the land, and the rough processed layers are formed in a side and top of the other conductor layer located within the same plane as the conductor layer. COPYRIGHT: (C)2007,JPO&INPIT |
